Ion beam trimmer
Sector: Advanced Electronics • Location: Espoo, Finland
Source: TED Europa
The object of the tender was 200 mm wafer particle beam trimming tool for VTT Micronova cleanroom semiconductor front end processing. The particle beam may be an ion beam, or a gas cluster beam, with a full width at half maximum within 3-15 mm.
The tool had to be compatible with installation in an ISO 4 classified cleanroom.
The object of the tender process was described in more detail in the
- Status
- Closed
- Sector
- Advanced Electronics
- Location
- Espoo, Finland
- Updated
- 3 Nov 2026
- Source
- TED Europa
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Tender Information
Participants
| Not available for this record. |
Status
Original status | contract award notice |
Taiyo status | Closed |
Taiyo last update | 2026-11-03 |
Contact
| Not available for this record. |
Description
Description | The object of the tender was 200 mm wafer particle beam trimming tool for VTT Micronova cleanroom semiconductor front end processing. The particle beam may be an ion beam, or a gas cluster beam, with a full width at half maximum within 3-15 mm. The tool had to be compatible with installation in an ISO 4 classified cleanroom. The object of the tender process was described in more detail in the invitation to tender documents. |
Original sector | Laboratory, optical and precision equipments (excl. glasses) |
Budget |
Location
Country | Finland |
City | Espoo |
Source
Source | TED Europa |
URL |
More Details
Record type | Tender |
Sector | Advanced Electronics |
Article published date | 2026-09-03 |
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