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ITEM: 2024 Chip Seal Aggregate

Sector: Government • Location: Port Orchard, Washington, United States of America

Source: Dodge USA

Tender
Bid Results
Status
Closed
Sector
Government, Commercial, Manufacturing (Industrial), Seaport
Location
Port Orchard, Washington, United States of America
Updated
22 Jul 2026
Source
Dodge USA

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Tender Information

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The tender “ITEM: 2024 Chip Seal Aggregate” is a tender record in Taiyo, linked to the Government sector. It is issued for works, goods, or services related to Port Orchard, Washington, United States of America.

Participants

Not available for this record.

Status

Original status

Bid Results

Taiyo status

Closed

Taiyo last update

2026-07-22

Contact

Not available for this record.

Description

Procurement method

Location

Country

United States of America (USA)

State

Washington

City

Port Orchard

Source

Source

Dodge USA

URL

More Details

Record type

Tender

Sector

Government, Commercial, Manufacturing (Industrial), Seaport

Article published date

2024-03-11

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