Laser release system 1 Set
Sector: Education • Location: Japan
Source: Japan External Trade Organization (JETRO)
Classification of the products to be procured : 2 Nature and quantity of the products to be purchased : Laser release system Set Type of the procurement : Purchase Basi requirements of the procurement : The system shall be capable of performing debonding and cleaning of bonded φ1 inch wafers. The processing section shall be equipped with two or more cleaning modules, enabling simultaneous cleanin
- Status
- Prospective
- Sector
- Education
- Location
- Japan
- Updated
- 3 Nov 2026
- Source
- Japan External Trade Organization (JETRO)
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Tender Information
Participants
| Not available for this record. |
Status
Original status | prospective |
Taiyo status | Prospective |
Taiyo last update | 2026-11-03 |
Contact
| Not available for this record. |
Description
Description | Classification of the products to be procured : 2 Nature and quantity of the products to be purchased : Laser release system Set Type of the procurement : Purchase Basi requirements of the procurement : The system shall be capable of performing debonding and cleaning of bonded φ1 inch wafers. The processing section shall be equipped with two or more cleaning modules, enabling simultaneous cleaning of both to and bottom wafers after debonding. Time limit for the submission of the requested material : 1 : 0 2 July, 202 Contact point for the notice : SUGI YAMA Eriko, Accounting and Contract Division, Finance Department, National University Corporation Yokohama National University, 79- Tokiwadai Hodogaya-ku Yokohama-shi 240-850 Japan, TEL 045-339-3241 |
Location
Country | Japan |
Source
Source | Japan External Trade Organization (JETRO) |
URL |
More Details
Record type | Tender |
Sector | Education |
Article published date | 2026-06-25 |
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