Metrology SEM+FIB system
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Source: TED Europa
The main purpose of this FIB/SEM equipment is to perform material milling (cutting), 3D characterization, and cross section analysis of epitaxially grown InP, InGaAs, InAlGaAs and InGaAsP layers on InP substrates. The structures may also contain polymer-based planarization layers, SiOx or SiNx dielectric layers and TiPtAu or NiGeAu metal layers. Levering van één SEM +FIB systeem
- Status
- Closed
- Sector
- Metal
- Location
- Netherlands
- Updated
- 3 Nov 2026
- Source
- TED Europa
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Tender Information
Participants
| Not available for this record. |
Status
Original status | contract notice |
Taiyo status | Closed |
Taiyo last update | 2026-11-03 |
Contact
| Not available for this record. |
Description
Description | The main purpose of this FIB/SEM equipment is to perform material milling (cutting), 3D characterization, and cross section analysis of epitaxially grown InP, InGaAs, InAlGaAs and InGaAsP layers on InP substrates. The structures may also contain polymer-based planarization layers, SiOx or SiNx dielectric layers and TiPtAu or NiGeAu metal layers. Levering van één SEM +FIB systeem |
Original sector | Electrical machinery, apparatus, equipment and consumables; lighting, Laboratory, optical and precision equipments (excl. glasses) |
Location
Country | Netherlands |
Source
Source | TED Europa |
URL |
More Details
Record type | Tender |
Sector | Metal |
Article published date | 2026-07-28 |
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