Montana Microfabrication Facility Chip Bonding Tool
Sector: Education • Location: Montana, United States of America
Source: Montana Purchasing Group
The Montana Microfabrication Facility will purchase a tool for chip bonding that will greatly enhance our ability to assemble and package photonic integrated circuits ( PICs ) and related devices with precise and repeatable alignment . Many photonic and electronic packaging tasks — such as attaching dies , lasers , or
- Status
- Closed
- Sector
- Education
- Location
- Montana, United States of America
- Updated
- 3 Nov 2026
- Source
- Montana Purchasing Group
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Tender Information
Participants
| Not available for this record. |
Status
Original status | closed |
Taiyo status | Closed |
Taiyo last update | 2026-11-03 |
Contact
| Not available for this record. |
Description
Description | The Montana Microfabrication Facility will purchase a tool for chip bonding that will greatly enhance our ability to assemble and package photonic integrated circuits ( PICs ) and related devices with precise and repeatable alignment . Many photonic and electronic packaging tasks — such as attaching dies , lasers , or detectors to optical or electrical substrates — require controlled placement , bonding force , and programmable temperature ramps . Such a tool would enable reliable , consistent attachment of components , reduce manual handling , and expand our lab ’ s capability to support PIC development , prototyping , packaging , and testing . |
Location
Country | United States of America (USA) |
State | Montana |
Source
Source | Montana Purchasing Group |
URL |
More Details
Record type | Tender |
Sector | Education |
Article published date | 2026-04-29 |
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