Prior Information Notice – Wafer Dicing Equipment
One of 10,000+ tenders Taiyo tracks in European Union.
Source: TED Europa
The Ferdinand-Braun-Institut (FBH) plans to procure mechanical wafer dicing equipment for backend processing within the framework of its ongoing infrastructure development activities. The system will be used for the separation of semiconductor wafers into individual chips (dicing). It shall support wafers up to 200 mm in diameter and be suitable for various semiconductor materials such as Si, SiC,
- Status
- Prospective
- Sector
- Advanced Electronics, Manufacturing (Industrial), Education, Road
- Location
- Unknown (Europe)
- Updated
- 3 Nov 2026
- Source
- TED Europa
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Tender Information
Participants
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Status
Original status | prior information notice |
Taiyo status | Prospective |
Taiyo last update | 2026-11-03 |
Contact
| Not available for this record. |
Description
Description | The Ferdinand-Braun-Institut (FBH) plans to procure mechanical wafer dicing equipment for backend processing within the framework of its ongoing infrastructure development activities. The system will be used for the separation of semiconductor wafers into individual chips (dicing). It shall support wafers up to 200 mm in diameter and be suitable for various semiconductor materials such as Si, SiC, GaN, InP and GaAs. The equipment is intended to ensure precise and reproducible dicing processes using mechanical blade-based technology. It will be installed in a cleanroom environment and must be compatible with ISO class 7 requirements. The procurement procedure is planned for 2026. |
Original sector | Industrial machinery |
Budget |
Location
Country | Unknown (Europe) |
Source
Source | TED Europa |
URL |
More Details
Record type | Tender |
Sector | Advanced Electronics, Manufacturing (Industrial), Education, Road |
Article published date | 2026-06-11 |
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