Prior Information Notice – Wafer Thinning Equipment
Prior information notice · European Union · Last reported Jun 2026
Source: TED Europa
The Ferdinand-Braun-Institut (FBH) plans to procure wafer thinning equipment for backend processing within the framework of its ongoing infrastructure development activities. The system will be used for the thinning of semiconductor wafers up to 200 mm diameter, including materials such as GaAs, SiC, InP, GaN and silicon. Wafer thinning is a key process step prior to wafer singulation. The equipme
- Status
- Prospective
- Sector
- Advanced Electronics, Manufacturing (Industrial), Education, Road
- Location
- Unknown (Europe)
- Updated
- 3 Nov 2026
- Source
- TED Europa
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Status
Original status | prior information notice |
Taiyo status | Prospective |
Taiyo last update | 2026-11-03 |
Contact
| Not available for this record. |
Description
Description | The Ferdinand-Braun-Institut (FBH) plans to procure wafer thinning equipment for backend processing within the framework of its ongoing infrastructure development activities. The system will be used for the thinning of semiconductor wafers up to 200 mm diameter, including materials such as GaAs, SiC, InP, GaN and silicon. Wafer thinning is a key process step prior to wafer singulation. The equipment is intended to enable precise thickness control and process monitoring, including in-situ measurement capabilities. It will be installed in a cleanroom environment and must be compatible with ISO class 5 requirements. The procurement procedure is planned for 2026. |
Original sector | Industrial machinery |
Budget |
Location
Country | Unknown (Europe) |
Source
Source | TED Europa |
URL |
More Details
Record type | Tender |
Sector | Advanced Electronics, Manufacturing (Industrial), Education, Road |
Article published date | 2026-06-11 |
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