Semi-Automatic Wafer Grinder
Contract award notice · Finland · Last reported Feb 2026
Source: TED Europa
The object of the tender was a Semi-Automatic Wafer Grinder with manual wafer loading and unloading on the chuck table (later also “Equipment”), capable of thinning Si, SiC, LiNbO3 and other typical semi-conducting wafers of 200 and 300 mm diameter to varying thicknesses with end-point control, TTV profile control, capability to thin wafers down to 10um thickness with supporting tape and capabilit
- Status
- Closed
- Sector
- Manufacturing (Industrial)
- Location
- Esp, Finland
- Updated
- 3 Nov 2026
- Source
- TED Europa
ConstructChat
Ask ConstructChat about Semi-Automatic Wafer Grinder
Pick a question to edit it, or write your own.
First answer free · no account
Tender Information FAQ
Tender Information
Participants
| Not available for this record. |
Status
Original status | contract award notice |
Taiyo status | Closed |
Taiyo last update | 2026-11-03 |
Contact
| Not available for this record. |
Description
Description | The object of the tender was a Semi-Automatic Wafer Grinder with manual wafer loading and unloading on the chuck table (later also “Equipment”), capable of thinning Si, SiC, LiNbO3 and other typical semi-conducting wafers of 200 and 300 mm diameter to varying thicknesses with end-point control, TTV profile control, capability to thin wafers down to 10um thickness with supporting tape and capability to grind only a determined distance from edge-to-center. Equipment had to be new. The tool had to comply with cleanroom equipment standard safety and contamination requirements. The object of the tender process was described in more detail in the invitation to tender documents. |
Original sector | Industrial machinery |
Budget |
Location
Country | Finland |
City | Esp |
Source
Source | TED Europa |
URL |
More Details
Record type | Tender |
Sector | Manufacturing (Industrial) |
Article published date | 2026-03-07 |
Research
Free account
View all details
You are reading the public part. A free account opens the rest:
- Every detail on this tender
- News and media coverage
- Technical research
Free account · no card · lands you back on this tender
More Manufacturing (Industrial) tenders in Finland
- Aalto-yliopiston konesalihankkeen infrastruktuurin suunnittelu, laitteistot ja asennus
- Syönninestoaineen hankinta
- Matalat pölynimurirobotit
- Sairaalatekstiilit 3 (Pyyhkeet, froteet ja lakanat)
- High-vacuum chamber for thin-film synthesis
- Ateriapakkausten suojakaasut Polkka Oy:lle
- Kulunvalvonnan hankinta
- Vesihuollon materiaalihankintojen puitejärjestely 2026-2027 + (1+1+1)