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Semiconductor Die Bonding And Vacuum Packaging System

Sector: Aerospace & Defense • Location: District of Columbia, United States of America

Source: SAM.gov

Tender
Sources Sought

NOTE: THIS IS NOT A SOLICITATION OR AN INDICATION THAT A CONTRACTUAL COMMITMENT WILL EXIST AS A RESULT OF THIS RFI. This Sources Sought Notice (SSN) is in support of market research and procurement planning being conducted by the Naval Research Laboratory (NRL), Washington, DC. This SSN is for informational and planning purposes only and does not guarantee that this will be competed via SAM.GOV. T

Status
Prospective
Sector
Aerospace & Defense, Advanced Electronics, Government, Commercial, Residential
Location
District of Columbia, United States of America
Updated
3 Nov 2026
Source
SAM.gov

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The tender “Semiconductor Die Bonding And Vacuum Packaging System” is a tender record in Taiyo, linked to the Aerospace & Defense sector. It is issued for works, goods, or services related to District of Columbia, United States of America.

Participants

Not available for this record.

Status

Original status

sources sought

Taiyo status

Prospective

Taiyo last update

2026-11-03

Contact

Not available for this record.

Description

Description

NOTE: THIS IS NOT A SOLICITATION OR AN INDICATION THAT A CONTRACTUAL COMMITMENT WILL EXIST AS A RESULT OF THIS RFI. This Sources Sought Notice (SSN) is in support of market research and procurement planning being conducted by the Naval Research Laboratory (NRL), Washington, DC. This SSN is for informational and planning purposes only and does not guarantee that this will be competed via SAM.GOV. The Government assumes NO financial responsibility for any costs incurred. A solicitation package is not available at this time. OBJECTIVE: The intent of this RFI is to gauge industry interest and search for potential sources capable of fulfilling a requirement for Semiconductor Die Bonding and Vacuum Packaging System in accordance with the attached draft specifications. The Government is currently in the planning stages for this procurement and may continue to modify the language within the requirement as necessary. These specifications do not necessarily represent the final specifications. CONTRACTOR RESPONSE FORMAT: Interested parties, at a minimum, shall supply all of the below required information in a Capability Statement. (Reference RFI N00173-26-RFI-KN02 in your response) 1. CONTACT INFORMATION a) Company Name and Address b) Point of Contact for question/clarification c) Telephone Number and e-mail address d) Unique Entity ID and CAGE Code e) PSC Code of the proposed solution (SEE https://psctool.us) f) Business Size/Socioeconomic Categories 2. TECHNICAL INFORMATION: a) List of capabilities/resources relevant to the attached specifications. b.) Any questions/suggestions related to the Specifications 3. COMMERCIALITY OF PROPOSED ITEM a) Whether item(s) offered/proposed is a commercial item and is customarily used by the general public or non-government entities for the other than Government purposes. b) Whether the item has been sold, leased, or licensed to the general public, and if so, identify one or more such sales, leases, or licenses to document the commerciality of the item. c) If the manufacturer of the component, please confirm if Authorized Resellers are available. ADDITIONAL REQUIREMENT DETAILS: Responses should be no more than 10 pages and should be emailed to the Contract Specialist at kevin.nguyen3.civ@us.navy.mil; and to the Contrcting Officer at jamie.l.dixon8.civ@us.navy.mil.

Original sector

Not Identified

Location

Country

United States of America (USA)

State

District of Columbia

Source

Source

SAM.gov

URL

More Details

Record type

Tender

Sector

Aerospace & Defense, Advanced Electronics, Government, Commercial, Residential

Article published date

2026-06-18

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