Semiconductor Die Bonding And Vacuum Packaging System
Sector: Residential • Location: Washington, District of Columbia, United States of America
Source: SAM.gov
This contract is awarded to COOK AND WEIL, INC. under simplified procedures for certain commercial items included in FAR subpart 13.5 for Semiconductor Die Bonding and Vaccuum Packaging System.
- Status
- Closed
- Sector
- Residential, Advanced Electronics, Aerospace & Defense, Manufacturing (Industrial), Commercial
- Location
- Washington, District of Columbia, United States of America
- Updated
- 3 Nov 2026
- Source
- SAM.gov
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Tender Information
Participants
| Not available for this record. |
Status
Original status | award notice |
Taiyo status | Closed |
Taiyo last update | 2026-11-03 |
Contact
| Not available for this record. |
Description
Description | This contract is awarded to COOK AND WEIL, INC. under simplified procedures for certain commercial items included in FAR subpart 13.5 for Semiconductor Die Bonding and Vaccuum Packaging System. |
Original sector | Not Identified |
Budget |
Location
Country | United States of America (USA) |
State | District of Columbia |
City | Washington |
Source
Source | SAM.gov |
URL |
More Details
Record type | Tender |
Sector | Residential, Advanced Electronics, Aerospace & Defense, Manufacturing (Industrial), Commercial |
Article published date | 2026-09-16 |
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