Question 1

What does the tender “Silicon Austria Labs – Chips JU: High power impulse magnetron sputtering and inductively-coupled plasma etching (HiPIMS & ICP)” cover and in which sector is it issued?

Accepted Answer

The tender “Silicon Austria Labs – Chips JU: High power impulse magnetron sputtering and inductively-coupled plasma etching (HiPIMS & ICP)” is a tender record in Taiyo, linked to the Power Generation (CCGT) sector. It is issued for works, goods, or services related to Villach, Austria.

Question 2

What is the current bidding status of the tender “Silicon Austria Labs – Chips JU: High power impulse magnetron sputtering and inductively-coupled plasma etching (HiPIMS & ICP)”?

Accepted Answer

The status recorded for “Silicon Austria Labs – Chips JU: High power impulse magnetron sputtering and inductively-coupled plasma etching (HiPIMS & ICP)” is contract award notice.

Question 3

What is the procurement method and commercial structure for “Silicon Austria Labs – Chips JU: High power impulse magnetron sputtering and inductively-coupled plasma etching (HiPIMS & ICP)”?

Accepted Answer

The budget is USD 1077085.

Question 4

How can I verify the tender source and access bidding documents for “Silicon Austria Labs – Chips JU: High power impulse magnetron sputtering and inductively-coupled plasma etching (HiPIMS & ICP)”?

Accepted Answer

Taiyo’s tender pages link back to the originating system via https://ted.europa.eu/en/notice/-/detail/00031435-2026, referencing TED Europa as the source. Users can follow the official link to download tender documents and submission instructions.

Original status	contract award notice
Taiyo status	Closed
Taiyo last update	2026-11-03

Description	The aim of this procurement procedure was to award the contract to the best bidder identified during the procurement procedure for the supply, installation and commissioning of two module chambers capable of high-power impulse magnetron sputtering and inductively coupled plasma surface preparation intended for the fabrication of various metal thin films, for Silicon Austria Labs GmbH.
Original sector	Laboratory, optical and precision equipments (excl. glasses)
Budget

Record type	Tender
Sector	Power Generation (CCGT), Metal, Manufacturing (Industrial), Education
Article published date	2026-01-16

Silicon Austria Labs – Chips JU: High power impulse magnetron sputtering and inductively-coupled plasma etching (HiPIMS & ICP)

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Country	Austria
City	Villach

Source	TED Europa
URL

Silicon Austria Labs – Chips JU: High power impulse magnetron sputtering and inductively-coupled plasma etching (HiPIMS & ICP)

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