Silicon Austria Labs – Chips JU: Plasma Activation system for D2W bonding
Sector: Electric Vehicles (EVs) • Location: Villach, Austria
Source: TED Europa
The aim of this procurement procedure was to award the contract to the best bidder identified during the procurement procedure for the supply, installation, commissioning and services (such as trainings) of a wafer-level plasma activation system for wafer bonding application for Silicon Austria Labs GmbH.
- Status
- Closed
- Sector
- Electric Vehicles (EVs), Automotive, Education, Road
- Location
- Villach, Austria
- Updated
- 3 Nov 2026
- Source
- TED Europa
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Tender Information
Participants
| Not available for this record. |
Status
Original status | contract award notice |
Taiyo status | Closed |
Taiyo last update | 2026-11-03 |
Contact
| Not available for this record. |
Description
Description | The aim of this procurement procedure was to award the contract to the best bidder identified during the procurement procedure for the supply, installation, commissioning and services (such as trainings) of a wafer-level plasma activation system for wafer bonding application for Silicon Austria Labs GmbH. |
Original sector | Laboratory, optical and precision equipments (excl. glasses) |
Budget |
Location
Country | Austria |
City | Villach |
Source
Source | TED Europa |
URL |
More Details
Record type | Tender |
Sector | Electric Vehicles (EVs), Automotive, Education, Road |
Article published date | 2026-08-05 |
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