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Silicon Austria Labs – Chips JU: Plasma Activation system for D2W bonding

Sector: Road • Location: Villach, Austria

Source: TED Europa

Tender
Contract Notice

The aim of this procurement procedure is to award the contract to the best bidder identified during the procurement procedure for the supply, installation, commissioning and services (such as trainings) of a wafer-level plasma activation system for wafer bonding application for Silicon Austria Labs GmbH.

Status
Closed
Sector
Road, Education
Location
Villach, Austria
Updated
3 Nov 2026
Source
TED Europa

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The tender “Silicon Austria Labs – Chips JU: Plasma Activation system for D2W bonding” is a tender record in Taiyo, linked to the Road sector. It is issued for works, goods, or services related to Villach, Austria.

Participants

Not available for this record.

Status

Original status

contract notice

Taiyo status

Closed

Taiyo last update

2026-11-03

Contact

Not available for this record.

Description

Description

The aim of this procurement procedure is to award the contract to the best bidder identified during the procurement procedure for the supply, installation, commissioning and services (such as trainings) of a wafer-level plasma activation system for wafer bonding application for Silicon Austria Labs GmbH.

Original sector

Laboratory, optical and precision equipments (excl. glasses)

Location

Country

Austria

City

Villach

Source

Source

TED Europa

URL

More Details

Record type

Tender

Sector

Road, Education

Article published date

2026-03-07

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