Single wafer processing dip/spin automatic cleaning system unit 2 1 set
Sector: Government • Location: Japan
Source: Japan External Trade Organization (JETRO)
Classification of the products to be procured : 2 Nature and quantity of the products to be purchased : Single wafer processing dip/spin automati cleaning system unit set Expected date of the contract award : August 12, 202 Reasons for the use single tendering procedures as provided for in the Agreement on Government Procurement : "Interchangeability" Contact point for the notice : KAWAMURA Rie
- Status
- Prospective
- Sector
- Government, Manufacturing (Industrial)
- Location
- Japan
- Updated
- 3 Nov 2026
- Source
- Japan External Trade Organization (JETRO)
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Tender Information
Participants
| Not available for this record. |
Status
Original status | prospective |
Taiyo status | Prospective |
Taiyo last update | 2026-11-03 |
Contact
| Not available for this record. |
Description
Description | Classification of the products to be procured : 2 Nature and quantity of the products to be purchased : Single wafer processing dip/spin automati cleaning system unit set Expected date of the contract award : August 12, 202 Reasons for the use single tendering procedures as provided for in the Agreement on Government Procurement : "Interchangeability" Contact point for the notice : KAWAMURA Rie, Tsukuba Central 1, Procurement Division, National Institute of Advanced Industrial Science and Technology, 1-1- Higashi, Tsukuba, Ibaraki, 305-856 Japan. TEL 050-3521-1331 |
Location
Country | Japan |
Source
Source | Japan External Trade Organization (JETRO) |
URL |
More Details
Record type | Tender |
Sector | Government, Manufacturing (Industrial) |
Article published date | 2026-07-23 |
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