Sub-Micron Die Bonder
Sector: Advanced Electronics • Location: United Kingdom
Source: Find a Tender Service (UK)
We are seeking equipment that can provide a wide range of bonding technologies to cater for semiconductor die to wafer, die to chip, wafer to wafer, fli-chip and other semiconductor chiplet bonding, to support our work in Heterogeneous Integration for Microelectronics and Semiconductor Systems.
- Status
- Prospective
- Sector
- Advanced Electronics, Education
- Location
- United Kingdom
- Updated
- 3 Nov 2026
- Source
- Find a Tender Service (UK)
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Tender Information
Participants
| Not available for this record. |
Status
Original status | planning |
Taiyo status | Prospective |
Taiyo last update | 2026-11-03 |
Contact
| Not available for this record. |
Description
Description | We are seeking equipment that can provide a wide range of bonding technologies to cater for semiconductor die to wafer, die to chip, wafer to wafer, fli-chip and other semiconductor chiplet bonding, to support our work in Heterogeneous Integration for Microelectronics and Semiconductor Systems. |
Location
Country | United Kingdom (UK) |
Source
Source | Find a Tender Service (UK) |
URL |
More Details
Record type | Tender |
Sector | Advanced Electronics, Education |
Article published date | 2026-09-21 |
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