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Sub-Micron Die Bonder

Planning · United Kingdom · Last reported Dec 2025

Source: GOV.UK

Tender
Planning

We are seeking equipment that can provide a wide range of bonding technologies to cater for semiconductor die to wafer, die to chip, wafer to wafer, fli-chip and other semiconductor chiplet bonding, to support our work in Heterogeneous Integration for Microelectronics and Semiconductor Systems. ... ...

Status
Prospective
Sector
Education, Advanced Electronics
Location
United Kingdom
Updated
3 Nov 2026
Source
GOV.UK

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Tender Information

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The tender “Sub-Micron Die Bonder” is a tender record in Taiyo, linked to the Education sector. It is issued for works, goods, or services related to United Kingdom.

Participants

Not available for this record.

Status

Original status

planning

Taiyo status

Prospective

Taiyo last update

2026-11-03

Contact

Not available for this record.

Description

Description

We are seeking equipment that can provide a wide range of bonding technologies to cater for semiconductor die to wafer, die to chip, wafer to wafer, fli-chip and other semiconductor chiplet bonding, to support our work in Heterogeneous Integration for Microelectronics and Semiconductor Systems. ... ...

Budget

Location

Country

United Kingdom (UK)

Source

Source

GOV.UK

URL

More Details

Record type

Tender

Sector

Education, Advanced Electronics

Article published date

2025-12-10

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