Supply and Delivery of FPGA Based Configurable Multi-Instrument Source and Detector
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Source: Public Contracts Scotland
BackgroundThe UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (
- Status
- Bidding
- Sector
- Advanced Electronics, Warehouse, Power Generation (CCGT), Education
- Location
- United Kingdom
- Updated
- 3 Nov 2026
- Source
- Public Contracts Scotland
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Status
Original status | open |
Taiyo status | Bidding |
Taiyo last update | 2026-11-03 |
Contact
| Not available for this record. |
Description
Description | BackgroundThe UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption.The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products.NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology – reducing time-to-market and anchoring value onshore.DescriptionUniversity of Strathclyde has a requirement for a FPGA based configurable multi instrument source and detector.CPV: 38000000. |
Location
Country | United Kingdom (UK) |
Source
Source | Public Contracts Scotland |
URL |
More Details
Record type | Tender |
Sector | Advanced Electronics, Warehouse, Power Generation (CCGT), Education |
Article published date | 2026-09-16 |
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