Supply, Delivery and Installation of Sinter Bonding Capability
Sector: Advanced Electronics • Location: United Kingdom
Source: Open Contracting Data Standard (OCDS)
National Manufacturing Institute Scotland (NMIS) is in the process of expanding its manufacturing capability into the semiconductor advanced packaging area with specific focus on power electronic semiconductors. To support this expansion, NMIS intends to procure equipment that is flexible to support a wide variety of power electronic semiconductor designs and packaging requirements. A solution is
- Status
- Closed
- Sector
- Advanced Electronics, Power Generation (CCGT), Education, Manufacturing (Industrial)
- Location
- United Kingdom
- Updated
- 3 Nov 2026
- Source
- Open Contracting Data Standard (OCDS)
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Tender Information
Participants
| Not available for this record. |
Status
Original status | complete |
Taiyo status | Closed |
Taiyo last update | 2026-11-03 |
Contact
| Not available for this record. |
Description
Description | National Manufacturing Institute Scotland (NMIS) is in the process of expanding its manufacturing capability into the semiconductor advanced packaging area with specific focus on power electronic semiconductors. To support this expansion, NMIS intends to procure equipment that is flexible to support a wide variety of power electronic semiconductor designs and packaging requirements. A solution is required to form sintered bonds between: dies on substrates in multi-die packages with different component heights; substrates on heat sinks; clips, spacers and interconnection parts; double-sided cooling packages. |
Location
Country | United Kingdom (UK) |
Source
Source | Open Contracting Data Standard (OCDS) |
URL |
More Details
Record type | Tender |
Sector | Advanced Electronics, Power Generation (CCGT), Education, Manufacturing (Industrial) |
Article published date | 2026-06-02 |
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