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Supply, Delivery and Installation of Wafer-Level Optical Tester

One of 9,237 tenders Taiyo tracks in Scotland.

Source: Public Contracts Scotland

Tender
Open

BackgroundThe UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (

Status
Closed
Sector
Advanced Electronics, Road, Education, Warehouse, Commercial, Power Generation (CCGT)
Location
United Kingdom
Updated
3 Nov 2026
Source
Public Contracts Scotland

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Tender Information

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The tender “Supply, Delivery and Installation of Wafer-Level Optical Tester” is a tender record in Taiyo, linked to the Advanced Electronics sector. It is issued for works, goods, or services related to Scotland.

Participants

Not available for this record.

Status

Original status

open

Taiyo status

Closed

Taiyo last update

2026-11-03

Contact

Not available for this record.

Description

Description

BackgroundThe UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption.The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products.NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology – reducing time-to-market and anchoring value onshore.DescriptionThe University of Strathclyde has a requirement for wafer-level optical tester(s) capable of performing characterization of both surface-emitting Distributed Feedback (DFB) laser arrays and silicon photonic integrated circuits (PICs).CPV: 38000000.

Location

Country

United Kingdom (UK)

Source

Source

Public Contracts Scotland

URL

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Record type

Tender

Sector

Advanced Electronics, Road, Education, Warehouse, Commercial, Power Generation (CCGT)

Article published date

2026-08-16

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