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Technology Showcase Facility & Support Services For Arpa-E’S Coolerchips Program

Sector: Residential • Location: United States of America

Source: SAM.gov

Tender
Combined Synopsis/Solicitation

You are invited to submit a quote in response to this RFQ. RFQ Objective: The Contractor will provide host site operations and support services necessary for ARPA-E to conduct the COOLERCHIPS Technology Program. The Contractor shall provide the facilities, utilities, infrastructure, engineering support, and logistical support necessary to support the technology showcase throughout the period of pe

Status
Prospective
Sector
Residential, Commercial
Location
United States of America
Updated
3 Nov 2026
Source
SAM.gov

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Tender Information FAQ

Tender Information

3 Q
The tender “Technology Showcase Facility & Support Services For Arpa-E’S Coolerchips Program” is a tender record in Taiyo, linked to the Residential sector. It is issued for works, goods, or services related to United States of America.

Participants

Not available for this record.

Status

Original status

combined synopsis/solicitation

Taiyo status

Prospective

Taiyo last update

2026-11-03

Contact

Not available for this record.

Description

Description

You are invited to submit a quote in response to this RFQ. RFQ Objective: The Contractor will provide host site operations and support services necessary for ARPA-E to conduct the COOLERCHIPS Technology Program. The Contractor shall provide the facilities, utilities, infrastructure, engineering support, and logistical support necessary to support the technology showcase throughout the period of performance. See the following attachments for more details pertaining to this RFQ: 1. RFQ Details 2. Attachment 1 - SOW 3. Attachment 2 - Pricing Worksheet 4. Attachment 3 - Terms & Conditions

Original sector

Professional, Scientific, and Technical Services

Location

Country

United States of America (USA)

Source

Source

SAM.gov

URL

More Details

Record type

Tender

Sector

Residential, Commercial

Article published date

2026-09-02

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