Wafer metrology
Contract notice · Finland · Last reported Apr 2026
Source: TED Europa
The object of the tender is semi-automatic wafer metrology tool (later also “tool”) for measurement of total thickness, TTV (total thickness variation), warp, bow, metallization bumps, trench or via depth and geometric factors in substrates typical in semiconductor industry such as but not limited to silicon wafers, chips, stacked wafers, stacked chips, samples containing mixed oxides, or/and thin
- Status
- Closed
- Sector
- Advanced Electronics, Chemical (Industrial), Road, Manufacturing (Industrial)
- Location
- Espoo, Finland
- Updated
- 3 Nov 2026
- Source
- TED Europa
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Tender Information
Participants
| Not available for this record. |
Status
Original status | contract notice |
Taiyo status | Closed |
Taiyo last update | 2026-11-03 |
Contact
| Not available for this record. |
Description
Description | The object of the tender is semi-automatic wafer metrology tool (later also “tool”) for measurement of total thickness, TTV (total thickness variation), warp, bow, metallization bumps, trench or via depth and geometric factors in substrates typical in semiconductor industry such as but not limited to silicon wafers, chips, stacked wafers, stacked chips, samples containing mixed oxides, or/and thin materials deposited. The tool must be compatible with installation in an ISO 4 classified cleanroom. The object of the tender process is described in more detail in the invitation to tender documents. |
Original sector | Laboratory, optical and precision equipments (excl. glasses), Laboratory, optical and precision equipments (excl. glasses) |
Location
Country | Finland |
City | Espoo |
Source
Source | TED Europa |
URL |
More Details
Record type | Tender |
Sector | Advanced Electronics, Chemical (Industrial), Road, Manufacturing (Industrial) |
Article published date | 2026-04-28 |
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